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ht500:manual [2016/03/23 10:33] Markus Bürgener [Initial commissioning] link updated |
ht500:manual [2016/04/13 12:33] Markus Bürgener [Functional principle] caption added |
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====== Structural and functional description ====== | ====== Structural and functional description ====== | ||
+ | The following paragraphs name and explain all components of the HT500 to give you an exact overview. The terms are used consistently throughout this manual and will help you identifying any part you may wish to find or [[http://kuehlingkuehling.de/shop|order as a spare part]]. | ||
+ | |||
+ | ===== Functional principle ===== | ||
+ | <WRAP group> | ||
+ | <WRAP half column> | ||
+ | The HT500 3D Printer uses the **F**used **F**ilament **F**abrication (FFF) process to build up workpieces in subsequent layers of 0.10 to 0.60mm thickness. The plastic filament is heated in the nozzle to its melting temperature and continuously conveyed by a cogwheel. The molten plastic is pressed through the bore of the nozzle tip and onto the heated print bed. After each layer the print bed is lowered by the preset layer height and the next layer is applied. The heat of the newly applied plastic ensures an adequate binding of the layers.\\ | ||
+ | \\ | ||
+ | All temperatures and movement commands are provided by the GCODE, a file format previously generated with a "slicing" software. This file contains all information for a single print job and is uploaded to the 3D Printer via the [[operation#the-web-interface|web interface]]. All Kühling&Kühling 3D Printers are built to operate best with [[http://slic3r.org|Slic3r]], an OpenSource Software designed for professional 3D printing.\\ | ||
+ | \\ | ||
+ | After the workpiece has been finished the user can leave it in the heated build chamber to slowly cool down thus reducing shrinkage and internal tensions, or he can immediately remove it and start the next print job. | ||
+ | The layered building process enables the user to create even complex forms that otherwise could not be realized. | ||
+ | </WRAP> | ||
+ | |||
+ | <WRAP half column> | ||
+ | [{{:ht500:fff_principle_manual.png?400|The layer-by-layer build-up of random geometries becomes possible with FFF-3D Printers.}}] | ||
+ | </WRAP> | ||
+ | </WRAP> | ||
+ | |||
+ | |||
+ | ===== Hardware components ===== | ||
<WRAP group> | <WRAP group> | ||
<WRAP half column> | <WRAP half column> | ||
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| 2 | [[#Electronic chamber|Electronic chamber]] | | | 2 | [[#Electronic chamber|Electronic chamber]] | | ||
| 3 | [[#Touchscreen|Touchscreen]] | | | 3 | [[#Touchscreen|Touchscreen]] | | ||
+ | <WRAP clear/> | ||
- | The following paragraphs name and explain all components of the HT500 to give you an exact overview. The terms are used consistently throughout this manual and will help you identifying any part you may wish to find or order as a spare part.\\ \\ | + | The HT500 is built on an aluminum framework covered with acrylic panels. Its main functional sections are the upper [[#Build chamber|build chamber]] and the lower [[#Electronic chamber|electronic chamber]]. The build chamber is covered with translucent plates to provide insight during production. It contains all mechanical components, the [[#air-filter|air filter]]. At the back cover, the [[#Filament supply|filament supply]] is installed.\\ \\ The lower is covered with opaque sheets and contains the electronic components and the mains adapter. All connections and the power switches are located here and the [[#Touchscreen|touchscreen]] for operation is mounted at the front cover.\\ \\ All covers are fixed to the frame with M4x20 hexagon socket screws and hammerhead nuts, thus being easy [[ht500:service-guide#opening-the-electronic-chamber|to remove]] and making all around access possible to all parts if required. |
- | The HT500 is built on an alloy framework and is mainly divided into two chambers. The upper [[#Build chamber|build chamber]] is covered with acrylic glass plates to provide insight during production. It contains all mechanical components. At the back cover, the [[#Filament supply|filament supply]] is installed.\\ \\ The lower [[#Electronic chamber|electronic chamber]] is covered with opaque plastic plates and contains the electronic components and the mains adapter. All connections and the power switches are located here and the [[#Touchscreen|touchscreen]] for operation is mounted at the front cover.\\ \\ All covers are fixed to the frame with M4x20 hexagon socket screws and hammerhead nuts, thus being easy [[ht500:service-guide#opening-the-electronic-chamber|to remove]] and making all around access possible to all parts if required. | + | |
</WRAP> | </WRAP> | ||
<WRAP half column> | <WRAP half column> | ||
- | [{{:reprap-industrial-v1:desc_bc_overview_1.png?400|General overview of the HT500 3D Printer.}}] | + | [{{:ht500:desc_main_1.png?400|General overview of the HT500 3D Printer.}}] |
</WRAP> | </WRAP> | ||
</WRAP> | </WRAP> | ||
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</WRAP> | </WRAP> | ||
- | ===== Build chamber ===== | + | ==== Build chamber ==== |
<WRAP group> | <WRAP group> | ||
<WRAP half column> | <WRAP half column> | ||
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|<100% 5% 95%>| | |<100% 5% 95%>| | ||
^ No. ^ Description ^ | ^ No. ^ Description ^ | ||
- | | 1 | [[http://doku.radds.org/en/|RADDS]] v1.5 3D Printer Controller | | + | | 1 | [[http://doku.radds.org/en/|RADDS]] v1.5 3D Printer Driver Shield | |
- | | 2 | [[http://www.udoo.org/|UDOO]] Single Board Mini PC | | + | | 2 | [[http://www.udoo.org/|UDOO Quad]] Single Board Mini PC | |
- | | 3 | 3V power supply for internal clock | | + | | 3 | 3V power supply for internal real-time clock | |
| 4 | Solid State Relays on cooling substructure | | | 4 | Solid State Relays on cooling substructure | | ||
| 5 | 12V(DC) Mains Adapter | | | 5 | 12V(DC) Mains Adapter | | ||
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The chamber is completely covered with white acrylic sheets fastened to the aluminum frame with hexagon socket screws and hammerhead nuts.\\ | The chamber is completely covered with white acrylic sheets fastened to the aluminum frame with hexagon socket screws and hammerhead nuts.\\ | ||
- | The RADDS 3D Printer Controller controls all processes of the printing process, i.e. the drives, the heating resistors, heating fans and the temperature sensors. Exchangeable hardware components are the stepper motor drivers.\\ | + | The RADDS 3D Printer Driver Shield in conjunction with the SAM3X microcontroller on the UDOO board controls all processes of the printing process, i.e. the drives, the heating resistors, heating fans and the temperature sensors. Exchangeable hardware components are the stepper motor drivers.\\ |
- | The UDOO Single Board Mini PC provides the GUI of the [[#Touchscreen|touchscreen]] and the ethernet connection and processes the G-codes of the slicing software.\\ | + | The UDOO Quad Single Board Mini PC provides the GUI of the [[#Touchscreen|touchscreen]] and the ethernet connection and processes the G-codes of the slicing software.\\ |
Slots in the bottom cover provide an air inlet for the cooling unit.\\ | Slots in the bottom cover provide an air inlet for the cooling unit.\\ | ||
- | When the 3D Printer is switched off the internal clock of the Mini PC is fed by two external batteries so that the time signal is not lost. | + | When the 3D Printer is switched off the internal real-time clock of the Mini PC is fed by two external batteries so that the system's time signal is not lost. |
The solid state relays switch the four heating resistors of the [[#Build chamber|build chamber]] heating and the heating resistor of the [[#Print table and print bed|print table]].\\ | The solid state relays switch the four heating resistors of the [[#Build chamber|build chamber]] heating and the heating resistor of the [[#Print table and print bed|print table]].\\ | ||
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The transport box is made of unfinished plywood and may hold splinters and sharp edges that can cause cutting injuries. | The transport box is made of unfinished plywood and may hold splinters and sharp edges that can cause cutting injuries. | ||
* Take care when removing the transport packaging and wear protective gloves. | * Take care when removing the transport packaging and wear protective gloves. | ||
+ | </WRAP> | ||
+ | |||
+ | |||
+ | <WRAP note> | ||
+ | NOTE | ||
+ | |||
+ | If the 3D Printer has a temperature below 16°C (e.g. directly after delivery in cold weather) there is a danger of air humidity condensing on sensitive electronic components. This can lead to severe damages due to short circuiting during commissioning.\\ Therefore, it is necessary to thoroughly let the 3D Printer warm up to ambient temperature for at least 12 hrs. at its operating place **prior** to commissioning.\\ Regard the [[technical-data#td-ac|ambient conditions]] required for operation. | ||
</WRAP> | </WRAP> | ||