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ht500:manual [2016/05/25 08:16]
Markus Bürgener [Hardware components] new graphic and structure
ht500:manual [2016/05/25 10:01]
Markus Bürgener [Sensors] pictures replaced, text restructured, content adapted
Line 524: Line 524:
 Every axis is equipped with a Hall effect sensor and a magnet for accurate home positioning. If the Hall effect sensor nears the magnet and measures the defined threshold value of the magnetic field strength, the sensor effects a "​stop"​ signal via the microcontroller. After all sensors have given this signal the moving axes are in home position. The home position is the reference value for all relative movement of the extruder head and the print bed. Every axis is equipped with a Hall effect sensor and a magnet for accurate home positioning. If the Hall effect sensor nears the magnet and measures the defined threshold value of the magnetic field strength, the sensor effects a "​stop"​ signal via the microcontroller. After all sensors have given this signal the moving axes are in home position. The home position is the reference value for all relative movement of the extruder head and the print bed.
  
-Temperature sensors (thermistors) measure the relevant temperatures for the printing process, i.e. the extruder temperature,​ the print bed temperature and the build chamber temperature. All thermistors deliver their input signal to the microcontroller and thus effect switching on and off the according heating resistor.\\ The extrusion temperature is measured at the [[#Extruder head components|heating block]] near the heating resistor and the relevant values for the control of the latter.\\ The print bed temperature is measured directly at the heating pad with which it is looped in a control circuit.\\ The build chamber sensor is installed at the elevator assembly and measures the air temperature inside the build chamber. Its measurements influence the control of the heating resistors inside the [[#Build chamber|heating elements]].+</​WRAP>​
  
-A limit switch is installed at every filament inlet of the filament feed unit (see [[#Filament supply|below]]).+<WRAP half column>​ 
 +[{{:​ht500:​desc_x-sensor.png?​400|Hall effect sensor and magnet ​of the X-axis.}}] 
 +[{{:​ht500:​desc_y-sensor.png?​400|Hall effect sensor and magnet of the Y-axis.}}] 
 +[{{:​ht500:​desc_z-sensor.png?​400|Hall effect sensor and magnet of the Z-axis.}}] 
 +</​WRAP>​
 </​WRAP>​ </​WRAP>​
  
 +<WRAP group>
 <WRAP half column> <WRAP half column>
-[{{:​reprap-industrial-v1:​desc_x-sensor.png?​400|Hall effect sensor ​and magnet of the X-axis.}}] +Thermistors measure the relevant temperatures for the printing process, i.e. the print bed temperature ​and the build chamber temperatureAll thermistors deliver their input signal to the microcontroller and thus effect ​switching on and off the according heating resistor.\\  
-[{{:​reprap-industrial-v1:​desc_y-sensor.png?​400|Hall ​effect ​sensor ​and magnet of the Y-axis.}}] +\\ 
-[{{:​reprap-industrial-v1:​desc_z-sensor.png?​400|Hall effect ​sensor and magnet of the Z-axis.}}] +The print bed temperature is measured directly at the heating pad with which it is looped in a control circuit.\\ The build chamber ​sensor ​is installed at the elevator assembly ​and measures ​the air temperature inside the build chamberIts measurements influence the control ​of the heating resistors inside ​the [[#​Build ​chamber|heating elements]].\\ 
-[{{:​reprap-industrial-v1:​desc_thermistors_printbed_chamber.png?​400|Thermistors ​of the print bed (1) and the build chamber ​(2).}}]+\\  
 +The extrusion temperature is measured directly at the [[#Extruder head components|heating cartridge]] by an integrated thermocouple.\\  
 </​WRAP>​ </​WRAP>​
 +
 +<WRAP half column>
 +[{{:​ht500:​desc_thermistors_printbed_chamber.png?​400|Thermistors of the print bed (1) and the build chamber (2).}}]
 </​WRAP>​ </​WRAP>​
 +</​WRAP>​
 +
 +A limit switch is installed at every filament inlet of the filament feed unit\\ (see [[#Filament supply|below]]).
  
 <WRAP clear></​WRAP>​ <WRAP clear></​WRAP>​
ht500/manual.txt · Last modified: 2018/06/11 14:23 by Simon Kühling